Products
Characteristics
・Localized plasma processing on the tabletop (processing size φ0.5～4 mm)
・Debris-free
・Power efficient
Configuration and specifications
| Standard | Optional |
|---|---|
|
Plasma gun (50 W) Vacuum chamber Vacuum pump (diaphragm type 15 L/min) RF generator (max. output 50 W), AC 100 V Manual matching box Single-axis stage (max. sample size φ30 mm) Vacuum gauge |
XYZ stage (max. sample size φ25 mm) Mass flow controller Auto matching box |
Examples
-
Specular finish of a Si wafer
Exposing LSI metal lines
Milling a thick PIQ film
Hydrophillic treatment
